IC Packaging And Testing May Benefit From Coming Policy In S

Data: 2014-01-02
Currently, the country has identified the introduction of policies to support the IC chip industry , the program led by the Ministry , has now entered a crucial stage, the program is expected to be finalized in the fourth quarter and sent high-level approval, the official release time may be a little later.The New Deal program will focus on chip manufacturing, chip design , chip packaging and upstream production equipment ( such as wafer furnace ) areas expand support. Operational level , mainly from the national level to support enterprises to increase capital investment . Formal financial support , there may be a way to take industrial investment funds . Object , will focus on supporting more than a dozen enterprises bigger and stronger .The most important feature of the new policy or that will increase capital investment on an unprecedented scale ; and had changed " sprinkle black pepper " approach , emphasizing the key support for more than ten enterprises bigger and stronger. This will facilitate industry consolidation , concentration of resources , leading manufacturers to enhance competitiveness, and promote the process of import substitution . New policy direction is to focus on fostering self- ic design , is expected to ic design and lead the entire industry chain.Domestic IC design in the industrial development of the critical moment the strong support of the State , is expected to enhance the degree of concentration in the industry, in the process, with only a few international companies competing places. And next year Spreadtrum and RDA 's return will no doubt set off industry and capital markets waves. Spreadtrum and RDA as the country's second , three ic design companies , if Purple Group will integrate the two , it will be national integration of resources , and promote international manufacturers ic design to a major event . 2013 is the year of recovery in the semiconductor industry , next year upward trend in the same industry . To add a new policy , the state support for unprecedented integration of industry resources around the corner, next year will be a bumper year semiconductor industry .At present, although the specific policy has not yet been introduced, but in accordance with the guiding ideology of the new policy , the most benefit manufacturers can be divided into two levels, namely ic design and manufacture of packaging and testing .

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