IC Packaging And Testing Semiconductor Wafer Manufacturers H

Data: 2014-01-02

Leading factory TSMC semiconductor capital spending next year is expected to reach billions of dollars to maintain high, pulled up with TSMC 20nm and 16nm production capacity expansion has asked partners, experts pointed out that the semiconductor wafer and IC packaging and testing and other manufacturers of high capital expenditure growth, which is driving the recent semiconductor equipment and supplies plant stand stock rose today as Hong Kang Shi Wo, medium sand were hanging close to daily limit, Gudeng, Xin Yun, Holley, Topco, Han and Tang also rose, the share price heated up, investors continued look pretty! First Gold Investment Advisory vice president Yi light that TSMC France said of the Annunciation, including wafer manufacturers and packaging and testing support for manufacturers misguide the next year's capital are unchanged this year will maintain high growth momentum, the semiconductor equipment and supplies stocks will result wafer testing and packaging manufacturers and manufacturers to maintain high growth capital spending unchanged, the results obtained inject and revenue, coupled with the end of the semiconductor equipment and supplies are delivered factory season, the third quarter and is expected to these populations are fourth quarterly report will be good, these ethnic groups is noteworthy, investors continued look pretty!

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